Solder, wire（Flux (With Resin)：Enter）

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• 

  Lead-Free Solder

  ENGINEER

  Non-washing type high performance solder containing flux achieves the same peel strength as conventional eutectic solder.
  [Features]
  · An ideal solder winding, with absolutely no absorbability or corrosivity in the residue, offers excellent electrical insulation and enables quick soldering work.
  · The flux contains no bromine or chlorine-based activators, and no washing is required after soldering.
  · Stick-type lead-free solder (Sn-Ag type) is easy to hold and solder.
  [Applications]
  · Optimal for soldering work in lead-free environments.

  • Volume Discount

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  Starting from∗ ：	18.07 €
  Min. Shipping Days ：	6 Days

  *Unit price with basic configuration

• 

  Lead-Free Solder

  AS ONE

  Uses non-corrosive mildly activated flux (RMA). Washing is not required.

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  Starting from∗ ：	59.07 €
  Min. Shipping Days ：	6 Days

  *Unit price with basic configuration

• 

  Superiot RA Noncleaning Solder

  ENGINEER

  Non-washing type high performance solder containing flux that can even solder stainless steel.
  [Features]
  · Non-washing type high performance solder containing flux.
  · A solder winding whose flux residue is non-corrosive and does not cause failure due to aging.
  · The residue is non-conductive and excellent in non-hygroscopicity and stability.
  · Has excellent sustainability of activity, and achieves a high spreading rate and wettability of the solder even on stainless steel, which cannot be soldered with conventional solder.
  · Employs organic amine-based special active rosin (non-chlorine based).
  · JIS-B class. Sn 60%, Pb 40% (melting point 183°C to 190°C).
  [Applications]
  · Optimal for soldering work of stainless steel and nickel.

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  Starting from∗ ：	11.03 €
  Min. Shipping Days ：	6 Days

  *Unit price with basic configuration

• 

  Superiot RMA Noncleaning Solder

  ENGINEER

  Non-washing type high performance solder containing flux, in which high reliability of the joining portion has been pursued.
  [Features]
  · Since the flux residue is completely non-corrosive, there is no need for washing the substrate after soldering.
  · The residue has excellent non-conductivity and non-hygroscopicity, with no occurrence of age deterioration, and is optimal for high-density mounting substrates.
  · Speeds up work with long sustainability of activity, an excellent spreading rate and excellent wettability of the solder.
  · Uses organic amine-based special active rosin (non-chlorine based). JIS-AA class, MIL-RMA standard compliant.
  [Applications]
  · For copper and copper alloy precision substrates.

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  Starting from∗ ：	11.70 €
  Min. Shipping Days ：	6 Days

  *Unit price with basic configuration

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